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IRF6156 Power MOSFET

IRF6156 Description

l Ultra Low RSS(on) per Footprint Area l Low Thermal Resistance l Bi-Directional N-Channel Switch l Super Low Profile (<.8mm) l Available Tested on Ta.
True chip-scale packaging is available from International Rectifier.

IRF6156 Applications

* These benefits, combined with the ruggedized device design that International Rectifier is well known for, provide the designer with an extremely efficient and reliable device. The FlipFET™ package, is one-fifth the footprint of a comparable TSSOP-8 package and has a profile of less than .8mm. Com

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Power MOSFET International Rectifier
International Rectifier IRF6156-like datasheet